Chip packaging 

Even in the „back end“ area of semi-conductor production micro wave plasma is a highly effective and gentle technology to clean the bond points ultra pure. Cleaning or activation before the packaging of semi-conductor parts or even at “flip chip” technology, the micro wave is the right choice because of its particular gentle and effective application.

To remove organic contamination or to treat oxide coating different process gases can be deployed.

Due to a wide range of accessories and process variants we are ready for the present demands.

With our roll to roll low pressure plasma equipment we can also treat flexible materials such as lead frames, foils and PCB.

 Plasma equipment of series AL is fashioned as table version or ready for integration in clean room walls.